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| 2322 661 97... Vishay BCcomponents Surface Mount PTC Thermistors For Overload Protection FEATURES * * * * * * Ideal for pick-and-place circuit assembly Low mounting height Suitable for reflow soldering Small ceramic diameter for faster response Low heat transfer to substrate Flat terminations for stable positioning and good solderability. APPLICATIONS QUICK REFERENCE DATA VALUE DESCRIPTION Nominal R25 Resistance tolerance Maximum overload current (voltage dependent) Non-trip current Maximum voltage Response time at 25 C and 20 W overload power Matching Maximum continuous power at STANDARD TYPES(1)(2) TELECOM TYPES(1)(2) 10 to 70 2 to 500 10%; 15%; 20% 2 to 10 A 50 to 500 mA 50 to 100 mA at 25 C at 70 C 16 to 400 V (RMS) 220 to 600 V ( RMS) <1 s - down to 0.5 2W * Telecom - Central office switching (C.O.) - Subscriber terminal equipment (T.E.) - Set top box - Modems - Cable TV communications * General industry and automotive - Low power supplies overload protection - Data bus protection. DESCRIPTION The component consists of a high-performance PTC ceramic disc mounted in a lead-frame for direct soldering onto a printed-circuit board (PCB) or substrate. The ceramic is soldered to the leadframe by a local reflow process, during which the solder layer is melted to the metallized ceramic surface using a low residue flux. Notes 1. Customized products are available on request. 2. Coated and/or reinforced types are available on request. MARKING * All SMD PTCs are marked with the last 3-digits of the type number and a date code (YYWW). ELECTRICAL DATA AND ORDERING INFORMATION R25 () (%) V MAX. (V) Int at 25 C 70 C It at 25 C MAX. TRIP-TIME tt (s) at It (mA) MATCHED PAIRS AVAILABLE CERAMIC SIZE (mm) CATALOG NUMBER 2322 661 ..... Telecommunication types; see note 1 40 25 265 80 50 130 2.5 500 15 to 20(1) - 300 150 100 250 1.5 1000 15 to 20(1) - 300 150 100 250 1.5 1000 25(1) 20 265 120 70 220 1.3 1000 35(1) +15/-20 425 110 70 175 1.0 1000 10(1) 20 245 165 100 270 3.0 1000 10(1) 20 245 165 100 270 3.0 1000 20(1) 20 300 120 70 250 1.4 1000 50 20 425 90 60 150 0.8 1000 General industrial types 25 60 150 100 300 4.0 600 9.4(1) 3.3(1) 25 24 400 - 650 6.0 1000 Note 1. These types pass "ITU-T K20/21" telecommunication protection recommendation. no 0.5 no 1 1 no 0.5 0.5 1 - - 6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 97002 97003 97004 97005 97009 97012 97016 97018 97019 97011 97013 Document Number: 29068 Revision: 10-Oct-03 For technical questions contact: nlr.europe@vishay.com www.vishay.com 147 2322 661 97... Vishay BCcomponents DIMENSIONS in millimeters 2 3 Surface Mount PTC Thermistors For Overload Protection MATERIAL INFORMATION REF. 1 2 3 DESCRIPTION ceramic metallization leadframe MATERIAL AND REMARKS BaTiO3 doped NiCr Ag layer (vacuum deposition) Ni plated phosphor bronze material covered by PbSn8 solder layer 1 3 2 Product outline. See Material Information table. HANDLING PRECAUTIONS The special leadframe construction and the applied processes do not allow high handling forces on the component. Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of perspiration can influence component behaviour at high temperatures. Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and to 10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the soldered product. For those applications where higher handling forces can be present, a re-inforced version is available on request. PTC OUTLINES PTC SMD ceramic size: 6.5 mm. 0 7.2 -0.2 8.0 3.45 0.15 2 0.2 1 10 max. 3.6 0.1 7.6 0.25 10 0.25 0.6 +0.6 0 1.2 2.8 4 0.2 For electrical data, see Electrical Data and Ordering Information table. 4 0.1 SOLDERING CONDITIONS This SMD thermistor is only suitable for reflow soldering, in accordance with "CECC 00802". Soldering processes which can be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 C during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. Typical examples of a soldering processes that will provide reliable joints without damage, are shown below. Reflow soldering. 300 10 s 260 C 245 C 215 C 200 180 C 40 s 10 s 200 180 C Vapour phase soldering. 300 Dimensions of the solder lands in millimeters T ( C) 250 T ( C) 250 215 C 20 to 40 s 2 150 150 130 C 130 C external preheating 100 C forced cooling 5 100 2 K/s 50 100 50 internal preheating, e.g. by infrared, max. 2 K/s 11 0 0 50 100 150 200 t (s) 250 0 0 50 100 150 200 t (s) 250 Typical values (solid line). Process limits (dotted lines). Typical values (solid line). Process limits (dotted line). www.vishay.com 148 For technical questions contact: nlr.europe@vishay.com Document Number: 29068 Revision: 10-Oct-03 2322 661 97... Surface Mount PTC Thermistors For Overload Protection PACKAGING TAPE SPECIFICATIONS All tape and reel specifications are in accordance with IEC 60286-3". Basic dimensions are given in Blister Tape and Reel drawings, and Material Information and Electrical Data and Ordering Information tables. Carrier tape material is conductive polystyrene or polycarbonate. Blister tape. K0 T D0 P2 E P0 Vishay BCcomponents cover tape B0 F W T1 T2 A0 P1 direction of unreeling D1 Cumulative pitch error: 0.2 mm over 10 pitches. Cumulative tolerance over 10 holes: 0.2 mm. Component orientation in the tape: large upper contact is situated on the sprocket hole side, see Component Orientation in the Tape drawing. For dimensions see Dimensions of Blister Tape table. DIMENSIONS OF BLISTER TAPE in millimeters SYMBOL A0; note 1 B0; note 1 K0 W E F D0 D1 P0; note 2 P1 P2 T tape thickness T1 cover tape T2 Notes 1. Measured 0.3 mm above base pocket. 2. P0 pitch tolerance over any 10 pitches is 0.2 mm. PRODUCT SIZE CODE 7.5 10.5 4.1 16 1.75 7.5 1.5 1.5 4 12 2 0.3 0.05 4.6 TOL. 0.1 0.1 0.1 0.3 0.1 0.1 +0.1/-0.0 +0.1/-0.0 0.1 0.1 0.1 0.03 - max. Component orientation in the tape. 005 0104 005 0104 005 0104 Document Number: 29068 Revision: 10-Oct-03 For technical questions contact: nlr.europe@vishay.com www.vishay.com 149 2322 661 97... Vishay BCcomponents Surface Mount PTC Thermistors For Overload Protection LEADER/TRAILER TAPE SPECIFICATION Leader/trailer tape. trailer end leader end empty compartments with cover tape (min. 240 mm) cover tape only trailer (min. 160 mm) leader 400 mm CCB838 TAPING PACKAGE REQUIREMENTS Component is free and not sticking to top and/or bottom tape. Component should be easy to remove from carrier tape. PEEL-OFF FORCE Peel-off force of blister tape is in accordance with "IEC 60286-3" ; that is, 0.1 to 1.3 N at a peel-off speed of 300 mm/minute. Peel-off force. peeling direction top cover tape 10 CCB289 carrier tape REEL SPECIFICATIONS in millimeters Reel. W2 20.5 12.75 0.15 N 0 A For reel dimensions see Electrical Data and Ordering Information table. W1 REEL DIMENSIONS in millimeters PRODUCT SIZE CODE 4028 Notes 1. Reels are packed in sealed plastic bags for protection against high humidity and corrosive atmospheres. 2. For matched components it is possible to have a maximum of one incomplete reel per resistance group. The minimum packaging quantity will be 500 units, with an even 100 up to 1400. www.vishay.com 150 For technical questions contact: nlr.europe@vishay.com Document Number: 29068 Revision: 10-Oct-03 UNITS(2) PER REEL 1500 TAPE WIDTH 16 A 330 N 62 W1 16.4 W2 MAX. 20.4 This datasheet has been downloaded from: www..com Datasheets for electronic components. |
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